Platinized Anodes for Semiconductor Industries:-

Tiaano Platinised Titanium Anodes and Platinised Niobium anodes are most suitable for Semiconductor / electronics Industries for plating of precious metals like gold, platinum, nickel, rhodium, silver and copper. This process called electroplating. Also known as electrodeposition, this process deposits a thin layer of metal on the surface of a work piece referred to as the substrate. Semiconductors are the foundation of the electronics industry. These partially conductive products include transistors, chips and other electronic control parts, and are integral to electronic equipment from mobile phones to cars and robots.

Platinum Plating on Semiconductors:-

Platinum is an extremely rare and expensive material, even more expensive than gold. However, platinum is an exceptionally smooth-surfaced and durable material that protects against corrosion. Manufactures primarily used it as a protective coating on low-voltage, low-energy contacts.

How does plating on semiconductors using Platinized Anodes?
  •  The plating metal is connected to the positively charged electrode of an electrical circuit. This electrode is called the anode (Platinum Plated Titanium / Niobium Anodes)
  •  The work piece, or substrate, is placed at the negatively charged electrode, called the cathode.
  •  Both the plating metal and the substrate are immersed in an electrolytic solution called a bath.
  •  After submersion, a DC current is supplied to the anode (Platinum Plated Anode), oxidizing the atoms of the plating metal and dissolving them into the bath. At the cathode, the negative charge reduces the atoms, causing them to plate the substrate.

This general process describes most electroplating. However, semiconductor electroplating is much smaller in scale than the average electroplating processes. The chips in question are often less than an inch in diameter, and the circuits inside them consist of miniscule wires. Any errors, such as breakage or the addition of dust particles to the semiconductor, can result in a defective product. As a result, semiconductor electroplating involves a few extra precautions and considerations in order to ensure the quality of the finished product.

  •  Platinised Titanium / Niobium Plate Electrode
  •  Platinised Titanium / Niobium Strip Electrode
  •  Platinized Titanium / Niobium Mesh Electrode
  •  Platinum Plated Titanium / Niobium Rod Electrode
  •  Platinum Plated Titanium / Niobium wire Electrode
  •  Platinised Titanium / Niobium Seamless Tube Electrode
  •  Increase anode lifetime without sacrificing quality
  •  Long service time even at high current density, maintenance-free
  •  Maintain predictable and stable electrode position rates
  •  Corrosion resistance ensures durability with easy maintainability
  •  A low consumption rate that conserves precious platinum
  •  Light weight, as well as favorable current distribution (in particular expanded metal anodes)
  •  High dimensional stability and load resistance.
  •  Energy saving potential, high electrical conductivity
  •  Higher quality of end product, Capability to produce an excellent finish
  •  Resistance to oxidation, High chemical stability
  •  Uniform current distribution properties and uniform conductivity
  •  Minimum installation time and cost
  •  No sludge, no pollution transfer
  •  Replating possible, Application-specific design